3rd Joint ISTDM / ICSI 2021 Conference
11th International SiGe Technology and Device Meeting (ISTDM)
13th International Conference on Silicon Epitaxy and Heterostructures (ICSI)
Merging ISTDM & ICSI
- ● The worldwide leading SiGe Meetings in Materials Science & Technology
- ● Due to the Pandemic, the meeting is postponed. New dates and venue will be announced later.
- ● The conference has been postponed due to Covid-19
- ● 1st call for paper for the ISTDM/ICSI 2021
- ● 1st Call for Papers for the 2021 ISTDM/ICSI
- ● ISTDM/ICSI 2021 abstract template
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● Paper submission system
ISTDM and ICSI are since decades among the worldwide most successful SiGe meetings to attract students, scientists and engineers from academia as well as industry. These biannual meetings will be merged in 2018 for the first time to offer a unique platform to discuss state-of-the-art research and development activities in the area of SiGe materials science and technology.
News
The conference has been postponed to November 01-05, 2021 due to the COVID-19. The actual date of conference will be announced at the website.
Paper submission will be opened at 00:01 on February 01, 2020. (GMT+8, Taipei time )
Prospective authors should submit two-page abstract including figures and tables in PDF format. The first page must be headed by the title of the paper, author(s), affiliation(s), address, telephone number, fax number, e-mail address of the corresponding author. The text of the abstract must clearly and concisely state the specific results of the work and its originality. An abstract template (Microsoft Word) is available below, and please follow the instructions for preparation of your abstract(s).
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Important Dates
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Sponsors
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Contact
Have questions? Feel free to email to istdm.icsi.2021@gmail.com.
Special Issue
Authors are encouraged to submit their original and extended papers on the significant part of their work presented at ISTDM/ICSI 2021 to the special issues. The suitable and excellent papers for possible publication in the special issues will be subjected to additional peer reviewing processes with free of charge for publication.
The special issues for the 3rd Joint ISTDM/ICSI 2021.