• ● Materials:Si, SiGe, GeSn, III-V, 2D, magnetic materials, and other novel materials
  • ● Process Technology:Cleaning, Epitaxy, Gate dielectrics, Dopant incorporation, Etching, Contact, Process integration
  • ● Devices:High mobility transistors (planar/3D), HBTs, NCFETs/TFETs, photonics devices (source/detector/solar cells), Quantum Computing, RF device, Device modeling, Carrier Transport, Memory Devices
  • ● Circuits/Applications:Wireless RF, Analog, Digital, Imaging Sensor, and Novel applications
  • ● Special sessions: Quantum Computing and Si Photonics